Label Jet

High-Temp Antistatic Labels

Product Overview

  • Designed for high-temperature processes: IR reflow (270°C ± 5°C) or dip solder (245°C ± 5°C), up to 350°C.
  • Available in low- and high-thickness options; bright white polyimide with dissipative adhesive and release liner.
  • Reinforced topcoat for circuit boards that undergo multiple harsh cleaning cycles.
  • Print stays clear and readable without reflow or preheating; minimum character size 4 pt.
  • Surface resistance meets ANSI/ESD S541-2008 dissipative ESD packaging range: 10⁴ ~ 10¹¹ ohm.
  • UL recognized; meets MIL-STD-202G Method 215K requirements.
  • Operating temperature range: -70°C to 350°C.

Product Features

  • RoHS, Halogen-free, and UL compliant
  • Non-conductive acrylic pressure-sensitive adhesive
  • Low triboelectric charging when peeled from the liner

Product List

General-Purpose High-Temp Labels

Type Model Finish Color Facestock Facestock Thickness Adhesive Adhesive Thickness Description / Application UL High Temp Low Temp Antistatic Abrasion
General-Purpose High-Temp Labels B-767 Gloss White Polyimide / PI 2 mil Acrylic 1.7 mil Antistatic PI label for PCB A-side application UL V V V V
B-768 Gloss White Polyimide / PI 1 mil Acrylic 1.5 mil Thinner version of B-767 UL V V V V
B-797 Matte White Polyimide / PI 2 mil Acrylic 1.5 mil Matte high-temp label for general electronics processes UL V V V V
B-728 Gloss White Polyimide / PI 2 mil Acrylic 1.8 mil Higher-tack option for more demanding surfaces UL V V V
B-724 Frosted Amber Polyimide / PI 2 mil Acrylic 1.5 mil Amber version of B-797 UL V V V
B-777 Gloss White Polyimide / PI 1 mil Acrylic 1.2 mil Ultra-thin high-temp label UL V V V
B-729 Matte White Polyimide / PI 2 mil Acrylic 1.7 mil Abrasion-reinforced option for repeated wipe-downs UL V V V V
B-416A Gloss White Polyimide / PI 2 mil Acrylic 1.5 mil General-purpose high-temp label for standard processes UL V V V
B-719 Frosted Amber Polyimide / PI 1 mil Acrylic 1.2 mil Thin amber high-temp label UL V V

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